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金剛石切割碟

上海益朗儀器有限公司

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價(jià)格：電議

所在地：上海

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更新時(shí)間：2024-03-19

瀏覽次數(shù)：3608

公司地址：臨夏路256號(hào)上海電子商城5號(hào)樓904室

13701600767 丁成峰(先生) 經(jīng)理

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產(chǎn)品簡(jiǎn)介

美國(guó)EXTEC含鉆石微粒切割碟：有高密度和低密度兩種，直徑有76mm,102mm,127mm,152mm,178mm.高密度適合經(jīng)常切割金屬及陶瓷；低密度適合切

公司簡(jiǎn)介

我司是精密測(cè)試儀器代理商，為在中國(guó)獨(dú)家代理美國(guó)Thermo-Electron X-射線測(cè)厚儀及德國(guó)ROENTGENANALYTIK Compact eco系列X-射線測(cè)厚儀。此兩種儀器主要用于鍍層或涂層厚度的測(cè)量，而且特別適合于對(duì)微細(xì)表面積或超薄鍍層的測(cè)量。以下我們公司其他主要產(chǎn)品：　　新加坡QTEST CIMS 特性阻抗測(cè)試儀　　韓國(guó)Micro Pioneer XRF-2000系列測(cè)厚儀　　美國(guó)Solar Metrology 太陽(yáng)能薄膜電池厚度測(cè)量?jī)x 　　日本KYORITSU WAK-水質(zhì)離子測(cè)試包　　美國(guó)WALCHEM（禾威）電鍍藥液自動(dòng)添加系統(tǒng) 　　美國(guó)OMEGA 600SMD離子污染測(cè)試儀　　美國(guó)UPA / VEECO非破壞性厚度測(cè)試儀　　美國(guó)EXTEC研磨 / 拋光器材及消耗品　　英國(guó)JENWAY分光光度計(jì) 　　美國(guó)Kocour庫(kù)侖測(cè)厚儀、侯氏槽、陰/陽(yáng)極片、離心機(jī)等　　德國(guó)SCAN-DIA研磨 / 拋光器材及消耗品　　美國(guó)INNOV-X伊諾斯RoHS分析儀(手提式:XRF 6500，臺(tái)式:Ray-tek1800) 　　美國(guó)ECI電鍍藥液分析系統(tǒng) 　　美國(guó)DICKSON/DeltaTRAK/OMEGA溫濕度記錄儀　　日本SHIMADZU(島津)分光光度計(jì)、X射線熒光分析儀　　日本IWAKI工業(yè)用泵　　韓國(guó)K-Mac ST4080-OSP 光學(xué)測(cè)厚儀　　美國(guó)SPELLMA******??電源供應(yīng)器　　日本KETT磁感/渦流涂層測(cè)試儀　　俄羅斯INTRON PTH-1/ITM-52手提式線路板孔銅測(cè)厚儀　　美國(guó)RPS可焊性測(cè)試儀　　美國(guó)UNITRON工業(yè)用顯微鏡系統(tǒng)及表面光滑度測(cè)試儀　　美國(guó)EXTECH多用途萬(wàn)用表　　美國(guó)CECO板材厚度測(cè)試儀、銅箔剝離強(qiáng)度儀　　一直致力于為PCB廠商，電鍍行業(yè)，科研機(jī)構(gòu)，半導(dǎo)體生產(chǎn)等電子行業(yè)提供高性能的儀器和優(yōu)質(zhì)的售后服務(wù)?！緎hanghai yilang yiqi youxiangongsi】

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產(chǎn)品說(shuō)明

美國(guó)EXTEC含鉆石微粒切割碟：有高密度和低密度兩種，直徑有76mm,102mm,127mm,152mm,178mm.高密度適合經(jīng)常切割金屬及陶瓷；低密度適合切割容易損壞的物料。
建議切割時(shí)添加冷卻液或清水可減低切割時(shí)間及增加切割度

EXTEC Diamond Wafering Blades are available in high or low concentration in 3" (76 mm), 4"(102 mm), 5" (127 mm), 6" (152 mm), 7" (178 mm) and 8” (203 mm) diameters. High concentration is designed for routine use with most metals and ceramics. Low concentration is recommended for brittle materials such as ceramics, glass, carbides and other heat
resistant materials. EXTEC EP Wafering Blades are specifically manufactured for soft and gummy materials. EXTEC I CBN (Cubic Boron Nitride) Wafering Blades are preferred for Iron and Cobalt Base Alloys, Nickel Base Super Alloys and Lead Base Alloys. DW Diamond Wafering Blades or AC Advanced Ceramic Diamond Wafering Blades come complete with a Dressing Stick. EP Diamond Wafering Blades do not require a Dressing Stick. EXTEC Universal or EXTEC Water Soluble Cutting Fluid is recommended for precision cutting and reduced cutting time.

12043 EXTEC AC Dressing Stick 1” x 1/2” x 3” (25.4 mm x 12.7 mm x 76 mm)
12045 EXTEC DW Dressing Stick 1” x 1/2” x 3” (25.4 mm x 12.7 mm x 76 mm)
12050 EXTEC Universal Cutting Fluid
12052 EXTEC Universal Cutting Fluid
12065 EXTEC Water Soluble Cutting Fluid
12067 EXTEC Water Soluble Cutting Fluid
EXTEC Diamond Wafering Blade, High Concentration
Recommended for: metal matrix composites, titanium, thermal spray coatings, printed circuit boards, bones
12200 3" Dia. x 0.006" Thickness x 1/2” Arbor (76 mm x 0.15 mm x 12.7 mm)
12205 4" Dia. x 0.012" Thickness x 1/2” Arbor (102 mm x 0.3 mm x 12.7 mm)
12210 5" Dia. x 0.015" Thickness x 1/2” Arbor (127 mm x 0.4 mm x 12.7 mm)
12215 6" Dia. x 0.020" Thickness x 1/2” Arbor (152 mm x 0.5 mm x 12.7 mm)
12220 7" Dia. x 0.025" Thickness x 1/2” Arbor (178 mm x 0.6 mm x 12.7 mm)
12218 8" Dia. x 0.035" Thickness x 1/2” Arbor (203 mm x 0.9 mm x 12.7 mm)
EXTEC Diamond Wafering Blade, High Concentration
Recommended for: aggressive cutting, ferrous and non-ferrous materials
12252 5" Dia. x 0.020" Thickness x 1/2” Arbor (127 mm x 0.5 mm x 12.7 mm)
12253 7" Dia. x 0.025" Thickness x 1/2” Arbor (178 mm x 0.6 mm x 12.7 mm)
12254 8" Dia. x 0.035" Thickness x 1/2” Arbor (203 mm x 0.9 mm x 12.7 mm)
EXTEC EP Diamond Wafering Blade, High Concentration
Recommended for: polymers, rubber, soft gummy materials
12222 4" Dia. x 0.012" Thickness x 1/2” Arbor (102 mm x 0.3 mm x 12.7 mm)
12224 5" Dia. x 0.015" Thickness x 1/2” Arbor (127 mm x 0.4 mm x 12.7 mm)
12226 7" Dia. x 0.025" Thickness x 1/2” Arbor (178 mm x 0.6 mm x 12.7 mm)
12228 8" Dia. x 0.035" Thickness x 1/2” Arbor (203 mm x 0.9 mm x 12.7 mm)
EXTEC Diamond Wafering Blade, Low Concentration
Recommended for: ceramics, glass, alumina, zirconia, concrete, electronic substrates
12230 3" Dia. x 0.006" Thickness x 1/2” Arbor (76 mm x 0.15 mm x 12.7 mm)
12235 4" Dia. x 0.012" Thickness x 1/2” Arbor (102 mm x 0.3 mm x 12.7 mm)
12236 4" Dia. x 0.020" Thickness x 1/2” Arbor (102 mm x 0.5 mm x 12.7 mm)
12240 5" Dia. x 0.015" Thickness x 1/2” Arbor (127 mm x 0.4 mm x 12.7 mm)
12245 6" Dia. x 0.020" Thickness x 1/2” Arbor (152 mm x 0.5 mm x 12.7 mm)
12250 7" Dia. x 0.025" Thickness x 1/2” Arbor (178 mm x 0.6 mm x 12.7 mm)
12248 8" Dia. x 0.035" Thickness x 1/2” Arbor (203 mm x 0.9 mm x 12.7 mm)
EXTEC Diamond Wafering Blade, Low Concentration
Recommended for: structural ceramics, boron nitride, silicon nitride
12257 5" Dia. x 0.020" Thickness x 1/2” Arbor (127 mm x 0.5 mm x 12.7 mm)
12258 7" Dia. x 0.025" Thickness x 1/2” Arbor (178 mm x 0.6 mm x 12.7 mm)
12259 8" Dia. x 0.035" Thickness x 1/2” Arbor (203 mm x 0.9 mm x 12.7 mm)
EXTEC AC (Advanced Ceramic) Diamond Wafering Blade, Low Concentration
Recommended for: medium ceramics, GaAs, AIN, glass fiber composites, electron packages
12190 3" Dia. x 0.006" Thickness x 1/2” Arbor (76 mm x 0.15 mm x 12.7 mm)
12192 4" Dia. x 0.012" Thickness x 1/2” Arbor (102 mm x 0.3 mm x 12.7 mm)
12194 5" Dia. x 0.020" Thickness x 1/2” Arbor (127 mm x 0.5 mm x 12.7 mm)
12196 7" Dia. x 0.025" Thickness x 1/2” Arbor (178 mm x 0.6 mm x 12.7 mm)
12198 8" Dia. x 0.025" Thickness x 1/2” Arbor (203 mm x 0.9 mm x 12.7 mm)
EXTEC Diamond Wafering Blade, Low Concentration
Recommended for: soft friable ceramics, composites with fine reinforcing media CaF, MgF, carbon composites
12193 3" Dia. x 0.006" Thickness x 1/2” Arbor (76 mm x 0.15 mm x 12.7 mm)
12195 5" Dia. x 0.015" Thickness x 1/2” Arbor (127 mm x 0.4 mm x 12.7 mm)
EXTEC I CBN (Cubic Boron Nitride) Wafering Blade, Low Concentration
Recommended for: iron and cobalt based allows, nickel based super alloys and lead based alloys
12345 3" Dia. x 0.006" Thickness x 1/2” Arbor (76 mm x 0.15 mm x 12.7 mm)
12350 4" Dia. x 0.012" Thickness x 1/2” Arbor (102 mm x 0.3 mm x 12.7 mm)
12355 5" Dia. x 0.015" Thickness x 1/2” Arbor (127 mm x 0.4 mm x 12.7 mm)
12260 6" Dia. x 0.020" Thickness x 1/2” Arbor (152 mm x 0.5 mm x 12.7 mm)
12265 7" Dia. x 0.025" Thickness x 1/2” Arbor (178 mm x 0.6 mm x 12.7 mm)
12268 8" Dia. x 0.035" Thickness x 1/2” Arbor (203 mm x 0.9 mm x 12.7 mm)

美國(guó)EXTEC研磨切割碟 ABRASIVE CUT-OFF WHEELS
樣品切割碟，邊緣以優(yōu)質(zhì)的材料制成，附設(shè)直徑6''(152mm)7''(178mm)9''(229mm)10''(254mm)12''(305mm)14''(356mm)。切割堅(jiān)硬，中等硬度，較軟的金屬，含鐵合金及鋼時(shí)，建議使用氧化鋁 (Al2O3)切割碟，碳化硅 (SiC)切割碟適用于中等硬度及較軟而不含鐵的金屬，堅(jiān)硬而不含金屬的混合物，鈦合金及制陶等

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